Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W
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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIC800H Low Steady-State Thermal Resistance 7.5W/MK Thermal Conductive Phase Change Material For AI And 5G Devices
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... Steady-State Thermal Resistance 7.5W/MK Thermal Conductive Phase Change Material For AI And 5G Devices Products description The TIC®800H Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Low Thermal Impedance 9.6W/mK Thermal Conductive Phase Change Material For Processors And Semiconductors
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... Impedance 9.6W/mK Thermal Conductive Phase Change Material For Processors And Semiconductors Company profile Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can ......
ZSUN CHIPS CO., LTD
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