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JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations

Name: JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations
Brand: Hiner-pack
Price: 1.35 USD

JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations

Categories	JEDEC IC Trays
Cavity Size:	45×45×6.35 mm
Model Number:	HN25088
Reusable:	Yes
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Quality Assurance:	Delivery Guarantee, Reliable Quality
Supply Ability:	2000PCS/Day
Tray Weight:	Varies, Typically Up To 500 Grams Per Cavity
MOQ:	500 pcs
Delivery Time:	10 workdays
Mold Type:	Injection
Payment Terms:	T/T
Color:	Black
Incoterms:	EXW, FOB, CIF, DDU, DDP
Clean Class:	General And Ultrasonic Cleaning
Brand Name:	Hiner-pack
Tray Shape:	Rectangular
Packaging Details:	CARTON, PALLET
Certification:	ROHS, ISO
Packing Level:	Transport package
Flatness:	Less than 0.76mm
Capacity:	2X6=12 PCS
Place of Origin:	China
Ic Type:	BGA,QFP,QFN,LGA,PGA

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Company Info.

Shenzhen Hiner Technology Co., Ltd.

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Product Details
Company Profile

JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations

Deliver outstanding heat resistance up to 150℃, built from robust Mppo raw material. Block static discharge and outside impurities. Keep stable physical performance under continuous high‑temperature workshop conditions, fit repeated circulation cycles.

Offer flexible custom cavity solutions as core capability. Adjust cavity layout, cell size and outer outline to match varied chip forms. Accept development according to sample or drawing references for unique semiconductor projects.

Support automated production line operation. Hold delicate chips firmly inside precision slots. Maintain reliable protection covering component loading, manufacturing processing and finished goods outbound shipment.

Key Features/ Benefits

Mppo heat‑proof raw material.
Dust reduction and anti-contamination.
RoHS compliant materials.
Reliable ESD anti‑static property.
Compatible with auto production lines.

Specifications

Brand		Hiner-pack
Model		HN25088
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×12.19 mm
Cavity Size		45×45×6.35 mm
Matrix QTY		2X6=12 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Adapt to semiconductor chip packaging and high‑temp assembly lines. Firmly lock chips during automated processing to avoid shift and scratch damage.

Suit component stock storage and cross‑workshop transfer. Shield sensitive chips from dust and static risks. Take custom modification for non‑standard chip specifications.

Packaging & Shipping/ Services

Stack together with separating protective boards, then pack inside thick reinforced cartons. Lower scratch and collision hazards during domestic site handling.

Support sea, air and express delivery channels. Keep stable production lead‑time. Use strengthened outer package to cut breakage risk for long‑distance overseas shipment.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

JEDEC IC Trays Protect Semiconductor Devices For Packaging And Handling Operations

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