Permanent Antistatic 2 Inch Waffle Pack Chip Trays For R&D
Prototyping And Batch Assembly
Waffle pack is positioned as a cost-effective, high-utility carrier
ideal for research and development laboratories, engineering lines,
and batch prototype assembly where initial costs and rapid
deployment are prioritized. While maintaining the high quality and
precision required for microelectronics, this tray focuses on the
widely accepted 2×2 inch format, which is convenient for small,
sensitive parts. It is constructed from a high-quality, permanent
antistatic ABS material. This material provides essential ESD
protection required for safely handling bare die and chip-scale
packages (CSPs) without the higher cost associated with specialized
bakeable or carbon-fiber reinforced materials, making it an
excellent entry-point solution.
Key Features/ Benefits
Specifications
| Brand | Hiner-pack |
| Model | HN24080 |
| Material | ABS |
| Tray Type | 2-inch Waffle Pack |
| Color | Black |
| Resistance | 1.0×10⁴ - 1.0×10¹¹ Ω |
| Outline Line Size | 50.7x50.7x4mm |
| Cavity Size | 5.84x4.57x0.72mm |
| Matrix QTY | 6x8=48PCS |
| Warpage | MAX 0.2mm |
| Service | Accept OEM, ODM |
| Certifications | RoHS, ISO |
Applications
This waffle pack is primarily applied in the initial stages of the
component lifecycle and in lower-volume processes. It is the
perfect fit for: R&D Laboratory Use, providing a safe and
organized way to manage and test small quantities of new
semiconductor or optical designs; Prototype Assembly and
Engineering Runs, enabling quick, safe handling of limited
component batches before full production scaling; Manual Die
Sorting and Inspection, where the tray's compact size and stable
pockets facilitate easy manual manipulation and visual quality
checks; and Internal Component Transfer, providing a low-cost,
secure carrier for moving components between different workstations
within a facility. Because many existing processes already utilize
the waffle pack format, this tray offers an easy, low-risk entry
point for new components moving into established workflows, making
the transition seamless and budget-friendly.
Customization
Customization for the R&D focused tray emphasizes functionality
and minimum non-recurring expenses (NRE). While the standard
material is Antistatic ABS, we offer customization of: Specific
Pocket Geometries tailored to protect critical features like
terminal pads or lenses on prototype components; Color Coding using
different antistatic resins to visually distinguish various
component revisions or test lots; and Simplified Mold Designs
optimized to reduce the NRE charge for entirely new custom
geometries. We are also able to integrate basic alignment features
like clearance cuts or tapered walls to accommodate early-stage,
semi-automated pick-and-place trials. Our expertise allows us to
provide custom-sized pockets and specific features without
over-engineering the solution, keeping the focus on speed and
cost-effectiveness for low-volume requirements.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that
integrates Design, R&D, Manufacturing, Sales of IC packaging
and testing, as well as semiconductive wafer fabrication process in
automated handling, carrying, and transportation to provide
customers with turnkey services.
Why Choose Us:
- Factory-direct manufacturer of JEDEC & IC trays
- JEDEC compliant, automation-compatible designs
- OEM & ODM customization supported
- Consistent quality and stable supply
- Trusted by global semiconductor customers
Customized 2”VCM IC Chip Tray die pack For Small Particle Chips
